PUBLICATIONS

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    BOOKS

    None
    MAGAZINE ARTICLES

    None


    CONFERENCE PRESENTATIONS

  1. H. Kam, D. T.  Lee, R. T. Howe, and T.-J. King, “A new nano-electro-mechanical field effect transistor (NEMFET) design for low-power electronics,” in Technical Digest of IEEE International Electron Devices Meeting, 2005, pp. 477-480, 2005.
  2. D. Lee, X. Sun, E. Quevy, R. T. Howe, and T.-J. King, "WetFET - Novel Fluidic Gate-Dielectric Transistor for Sensor Applications," in Technical Digest of IEEE VLSI-TSA Meeting, 2007, pp. 124-125. VLSI-TSA 2007 Best Student Paper Award
  3. W.Y. Choi, H. Kam, D. Lee, J. Lai, and T. King Liu, “Compact Nano-Electro-Mechanical Non-Volatile Memory (NEMory) for 3D Integration,” in Technical Digest of IEEE International Electron Devices Meeting, 2007, pp. 603-606.
  4. D. Lee, V. Pott, H. Kam, R. Nathanael, T.-J. King Liu, “AFM Adhesion Force Characterization for Relay Applications,“  to be presented at the IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010).

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    REFEREED PUBLICATIONS

  1. D. Lee, T. Seidel, J. Dalton, and T.-J. King Liu, "ALD Refill of Nanometer-scale Gaps with High-k Dielectric for Advanced CMOS Technologies," Electrochemical and Solid State Letters, Vol 10, Issue 9, pp. H257-H259, 2007.
  2. D. Lee, T. Osabe, and T.-J. King Liu, "Scaling Limitation for Flexural Beams Used in Electromechanical Devices," IEEE Transactions of Electron Devices, Vol 56, Issue 4, pp. 688-691, 2009.
  3.  I. Laboriante,  B. Bush,  D. Lee, F. Liu,  T.-J. King Liu, C. Carraro a and R. Maboudian, "Interfacial Adhesion between Rough Surfaces of Polycrystalline Silicon and its Implications for M/NEMS Technology," Journal of Adhesion Science and Technology, submitted June 2009 for consideration.
  4. D. Lee, H. Tran, T.-J. King Liu, “ Characterization of Nanometer-Scale Gap Formation,”  to be published  in Journal of the Electrochemical Society (JES).
  5. D. Lee, H. Tran, B. Ho, T.-J. King Liu, "Electrical Characterization of Etch Rate for Micro- and Nano-scale Gap Formation," submitted to Journal of Microelectromechanical Systems (JMEMS) August 2009.


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    PATENTS

  1. D. Lee and K. Khazeni, "Three-dimensional Interferometric Modulator Display Devices," US Patent Application No. 60/972,717, filed 15 September 2007.
  2. D. Lee, "Device and Method for Electrical Undercut Characterization," UC Disclosure B10-048, filed19 October 2009.
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Last updated 5 October 2009