Debbie G. Senesky, Ph.D.

Postdoctoral Researcher
Mechanical Engineering

Berkeley Sensor and Actuator Center
University of California
Berkeley, CA 94720-1774

Phone: (510) 642-9713
Fax: (510) 643-6637
Email: dsenesky -at- eecs.berkeley.edu

Education:
Ph.D. Mechanical Engineering, University of California, Berkeley (2007)
M.S. Mechanical Engineering, University of California, Berkeley (2004)
B.S. Mechanical Engineering, University of Southern California (2001)

Research Interests:
-Harsh environment sensors for energy efficiency
-Energy conversion materials and systems
-Silicon Carbide (SiC) thin film deposition
-SiC microfabrication technology
-Thin film device encapsualtion

Experience:
-MEMS Design Engineer, GE Sensing (formerly NovaSensor), 2007-2008
-Graduate Student Researcher, University of California, Berkeley, 2001-2007
-MEMS Research Intern, General Electric Global Research, Summer 2004
-Hardware Engineering Intern, Delphi Automotive Systems, Summer 2001
-Product Engineering Intern, Hewlett-Packard, Summer 2000

Patents:
U.S. Patent #7,221,144, “Micro-electromechanical system (MEMS) based current & magnetic field sensor having improved sensitivities,” Co-inventor while at General Electric Company.

Publications:

NOTE: Publications before 2008 use maiden name, Debbie G. Jones.

Senesky, D. G., and A.P. Pisano, “Aluminum Nitride as a Masking Material for the Plasma Etching of Silicon Carbide Structures,” Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, accepted for publication.

Yen, T.-T., Lin, C.M., Zhao, X., Senesky, D.G., Hopcroft, M.A., and A.P. Pisano, “Characterization of Aluminum Nitride Lamb Wave Resonators Operating At 600°C For Harsh Environment RF Applications,” Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, accepted for publication.

Senesky, D. G., Jamshidi, B., Cheng, K. B., and A.P. Pisano, “Harsh Environment Silicon Carbide Sensors for Health and Performance Monitoring of Aerospace Systems: a Review,” IEEE Sensors Journal, vol. 9, no. 11, pp. 1472-1478, 2009.

Myers, D.R., Cheng, K.B., Jamshidi, B., Azevedo, R.G., Senesky, D.G., Chen, L., Mehregany, M., Wijesundara, M.B.J., and A.P. Pisano, “A Silicon Carbide Resonant Tuning Fork for Micro-Sensing Applications in High Temperature and High G-Shock Environments,” Journal of Micro/Nanolithography, MEMS, and MOEMS, vol.8, no.2, 021116, 2009.

Lien, W.C., Cheng, K.B., Senesky, D.G., Carraro, C., Pisano, A.P., and R. Maboudian “Epitaxial Growth of 3C-SiC on AlN/Si (100) via Methyltrichlorosilane-based Chemical Vapor Deposition” In Proceedings of the International Workshop on 3C-SiC Hetero-epitaxy, Catania, Italy, 2009.

Park, S.W., Senesky, D. G., and A.P. Pisano, “Electrodeposition of Permalloy in Deep Silicon Trenches without Edge-Overgrowth Utilizing Dry Film Photoresist,” In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Sorrento, Italy, 2009.

K. B. Cheng, D. R. Myers, B. Jamshidi, R. G. Azevedo, D. G. Jones, M. Mehregany, M. B. J. Wijesundara, A. P. Pisano, “High Resolution Silicon Carbide Strain Gauge at 600oC,” In Proceedings of Asia-Pacific Conference on Transducers and Micro-Nano Technology, APCOT, 2008.

Azevedo, R.G., Jones, D. G., Jog, A.V., Jamshidi, B., Myers, D.R., Chen, L., Fu, X., Mehregany, M., Wijesundara, M.B.J., and A.P. Pisano, “A SiC MEMS Resonant Strain Sensor for Harsh Environment Applications,” IEEE Sensors Journal, vol. 7, no. 4, pp. 568-576, 2007.

Jones, D. G., and A.P. Pisano, “Ion Beam Sputter Deposition of Silicon Carbide for Vacuum Encapsulation,” In Proceedings of the MicroElectronics Packaging & Test Engineering Council (MEPTEC) MEMS Symposium, San Jose, California, 2007.

Jones, D. G., Azevedo, R. G., Chan, M. W., Pisano, A. P., and M. B. J. Wijesundara, “Low Temperature Ion Beam Sputter Deposition of Amorphous Silicon Carbide for Vacuum Encapsulation,” In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Kobe, Japan, 2007.

Azevedo, R. G., Zhang, J., Jones, D. G., Myers, D. R., Jog, A.V., Jamshidi, B., Wijesundara, M.B.J., Maboudian, R., and A.P. Pisano, “Silicon Carbide Coated MEMS Strain Sensor for Harsh Environment Applications, In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Kobe, Japan, 2007.

Jones, D. G., and A.P. Pisano, “Fabrication of Ultra Thick Ferromagnetic Structures in Silicon,” In Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE, Anaheim, California, 2004.

Fernandez-Pello, A. C., Pisano, A. P., Fu, K., Walther, D., Knobloch, A., Martinez, F., Senesky, M., Jones, D., Stoldt, C., and J. Heppner, “MEMS Rotary Engine Power System,” In Proceedings of the International Workshop on Power MEMS, Tsukuba, Japan, 2002.