Debbie G. Senesky, Ph.D.

Research Specialist (Postdoctoral Researcher)
Department of Mechanical Engineering

Berkeley Sensor and Actuator Center
University of California
497 Cory Hall #1774
Berkeley, CA 94720-1774

Phone: (510) 642-9713
Fax: (510) 643-6637
Email: dsenesky -at- berkeley.edu

Education:
Ph.D. Mechanical Engineering, University of California, Berkeley (2007)
M.S. Mechanical Engineering, University of California, Berkeley (2004)
B.S. Mechanical Engineering, University of Southern California (2001)

Research Interests:
-Harsh environment sensing technology (aerospace, combustion and geothermal)
-Smart ceramic materials - Silicon Carbide (SiC) and Aluminum Nitride (AlN)
-Structural health monitoring of ceramics
-Energy conversion materials and systems

Experience:
-Design Engineer, GE Sensing (formerly NovaSensor), 2007-2008
-Graduate Student Researcher, University of California, Berkeley, 2001-2007
-Research Intern, General Electric Global Research, Summer 2004
-Hardware Engineering Intern, Delphi Automotive Systems, Summer 2001
-Product Engineering Intern, Hewlett-Packard, Summer 2000

Teaching:
Instructor, Parametric and Optimal Design of MEMS - ME219/EE246, Spring 2011

Patents:
U.S. Patent #7,221,144, “Micro-electromechanical system (MEMS) based current & magnetic field sensor having improved sensitivities,” Co-inventor while at General Electric Company.

Publications:

NOTE: Publications before 2008 use maiden name, Debbie G. Jones.

Senesky, D. G. and Jamshidi, B. (2011). MEMS Strain Sensors for Intelligent Structural Systems. In S. Mukhopadhyay (Ed.), New Developments in Sensing Technology for Structural Health Monitoring, Springer-Verlag, In press.

Hsia, B., Ferralis, N., Senesky, D. G., Pisano, A.P., Carraro, C. and Maboudian, R., “Epitaxial Graphene Growth on 3C-SiC(111)/AlN(0001)/Si(100),” Electrochemical and Solid-State Letters, vol. 14, no. 2, pp. K13-K15, 2011.

Lin, C.-M., Lien, W.-C, Felmetsger, V., Hopcroft, M.A., Senesky, D. G. and Pisano, A.P. “AlN thin films grown on epitaxial 3C–SiC (100) for piezoelectric resonant devices,” Applied Physics Letters, 97, 141907, 2010.

Lien, W.-C., Cheng, K.B., Senesky, D. G., Carraro, C., Pisano, A.P., and R. Maboudian, “Growth of 3C-SiC/AlN/Si(100) layered structure with atomically abrupt interface via modified precursor feeding procedure,” Electrochemical and Solid-State Letters, vol. 13, no. 7, pp. D53-D56, 2010.

Liu, F., Hsia, B., Senesky, D. G., Carraro, C., Pisano, A.P., and R. Maboudian, “Ohmic Contact With Enhanced Stability to Polycrystalline Silicon Carbide Via Carbon Interfacial Layer,” In Proceedings of the Solid-State Sensors, Actuators and Microsystems Workshop, pp. 214-217, Hilton Head, South Carolina, 2010.

Lin, C.-M., Lien, W.-C, Felmetsger, V., Senesky, D. G., Hopcroft, M.A. and A.P. Pisano, “Growth of Highly C-Axis Oriented AlN Films on 3C-SiC/Si Substrate,” In Proceedings of the Solid-State Sensors, Actuators and Microsystems Workshop, pp. 324-327, Hilton Head, South Carolina, 2010.

Senesky, D. G., and A.P. Pisano, “Aluminum Nitride as a Masking Material for the Plasma Etching of Silicon Carbide Structures,” In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, pp. 352-355, Hong Kong, 2010.

Yen, T.-T., Lin, C.M., Zhao, X., Senesky, D. G., Hopcroft, M.A., and A.P. Pisano, “Characterization of Aluminum Nitride Lamb Wave Resonators Operating At 600°C For Harsh Environment RF Applications,” Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, pp. 731-734, Hong Kong, 2010.

Lai, Y.J., Senesky, D. G. and A.P. Pisano, “Genetic Algorithm Optimization for MEMS Cantilevered Piezoelectric Energy Harvesters,” In Proceedings of the International Workshop on Power MEMS, pp. 111-114, Leuven, Belgium, 2010.

Wodin-Schwartz, S., Hopcroft, M.A., Senesky, D. G. and A.P. Pisano “MEMS Sensing in an In-Cylinder Combustion Environment, In Proceedings of the International Workshop on Power MEMS, pp. 123-126, Leuven, Belgium, 2010.

Senesky, D. G., Jamshidi, B., Cheng, K. B., and A.P. Pisano, “Harsh Environment Silicon Carbide Sensors for Health and Performance Monitoring of Aerospace Systems: a Review,” IEEE Sensors Journal, vol. 9, no. 11, pp. 1472-1478, 2009.

Myers, D.R., Cheng, K.B., Jamshidi, B., Azevedo, R.G., Senesky, D. G., Chen, L., Mehregany, M., Wijesundara, M.B.J., and A.P. Pisano, “A Silicon Carbide Resonant Tuning Fork for Micro-Sensing Applications in High Temperature and High G-Shock Environments,” Journal of Micro/Nanolithography, MEMS, and MOEMS, vol.8, no.2, 021116, 2009.

Lien, W.C., Cheng, K.B., Senesky, D. G., Carraro, C., Pisano, A.P., and R. Maboudian “Epitaxial Growth of 3C-SiC on AlN/Si (100) via Methyltrichlorosilane-based Chemical Vapor Deposition” In Proceedings of the International Workshop on 3C-SiC Hetero-epitaxy, Catania, Italy, 2009.

Park, S.W., Senesky, D. G., and A.P. Pisano, “Electrodeposition of Permalloy in Deep Silicon Trenches without Edge-Overgrowth Utilizing Dry Film Photoresist,” In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Sorrento, Italy, 2009.

K. B. Cheng, D. R. Myers, B. Jamshidi, R. G. Azevedo, D. G. Jones, M. Mehregany, M. B. J. Wijesundara, A. P. Pisano, “High Resolution Silicon Carbide Strain Gauge at 600°C,” In Proceedings of Asia-Pacific Conference on Transducers and Micro-Nano Technology, APCOT, 2008.

Azevedo, R.G., D. G. Jones, Jog, A.V., Jamshidi, B., Myers, D.R., Chen, L., Fu, X., Mehregany, M., Wijesundara, M.B.J., and A.P. Pisano, “A SiC MEMS Resonant Strain Sensor for Harsh Environment Applications,” IEEE Sensors Journal, vol. 7, no. 4, pp. 568-576, 2007.

D. G. Jones, and A.P. Pisano, “Ion Beam Sputter Deposition of Silicon Carbide for Vacuum Encapsulation,” In Proceedings of the MicroElectronics Packaging & Test Engineering Council (MEPTEC) MEMS Symposium, San Jose, California, 2007.

D. G. Jones, Azevedo, R. G., Chan, M. W., Pisano, A. P., and M. B. J. Wijesundara, “Low Temperature Ion Beam Sputter Deposition of Amorphous Silicon Carbide for Vacuum Encapsulation,” In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Kobe, Japan, 2007.

Azevedo, R. G., Zhang, J., D. G. Jones, Myers, D. R., Jog, A.V., Jamshidi, B., Wijesundara, M.B.J., Maboudian, R., and A.P. Pisano, “Silicon Carbide Coated MEMS Strain Sensor for Harsh Environment Applications, In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, IEEE MEMS, Kobe, Japan, 2007.

D. G. Jones, and A.P. Pisano, “Fabrication of Ultra Thick Ferromagnetic Structures in Silicon,” In Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE, Anaheim, California, 2004.

Fernandez-Pello, A. C., Pisano, A. P., Fu, K., Walther, D., Knobloch, A., Martinez, F., Senesky, M., D. G. Jones, Stoldt, C., and J. Heppner, “MEMS Rotary Engine Power System,” In Proceedings of the International Workshop on Power MEMS, Tsukuba, Japan, 2002.