2001 Conf Pubs
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Must Read Papers:



1.51-GHz with Q >10,000 Even in Air!
A result of purposely impedance-mismatching a polydiamond disk with its polysilicon stem.

 

1.2-GHz with Q = 14,600!

Who says diamond is needed to get Q >10,000 at GHz frequencies? With the right "hollow-disk" ring design, polysilicon can do even better than diamond.

 

 

60-MHz Wine-Glass Disk Oscillator Makes the GSM Reference Oscillator Spec!
Higher power handling and a Q >50,000 crucial in making the spec.

 

 

Arraying for Impedance <480W at 72MHz!
Mechanically coupled resonator arrays automatically align resonator frequencies to allow output summation for low impedance and higher power handling.

 

First Analytical Treatment for Intermodulation Distortion in Capacitively Transduced Micromechanical Resonators -- not great for the CC-beams of 2001, but much better today (2001)

 

The Latest Award Winning Papers:


Solid-Gap Vibrating Micromechanical Resonator Wins Best Paper Award at the 2005 IEEE Int. Frequency Control Symposium!
Congratulations to Yu-Wei Lin for winning the Best Frequency Control Paper Award at the 2005 IEEE  Int. Frequency Control Symposium.

 


Chip-Scale Atomic Clock Overview Paper Wins the Jack Raper Award at the 2005 IEEE Int. Solid-State Circuits Conference!
Congratulations to all those in the CSAC program (which Prof. Nguyen ran while at DARPA), especially John Kitching from NIST, who co-authored this paper.

 


Vibrating RF MEMS Wins Best Invited Paper Award at the 2004 IEEE Custom Integrated Circuits Conference!
Read this for an overview on vibrating RF MEMS.

 


Resonator Array Oscillator Wins 2004 UFFC Symposium Best Frequency Control Paper Award!
Congratulations to Seungbae Lee for winning the Best Frequency Control Paper Award at the 2004 IEEE Ultrasonics, Ferroelectrics, and Frequency Control 50th Anniv. Joint Conf.

 


Ext. Wine-Glass Resonator Work Wins 2003 IEDM Best Paper Award!
Congratulations to Yuan Xie for winning the 2003 Int. Electron Devices Meeting Roger A. Haken Best Student Paper Award.

 

Lateral Free-Free Beam With Metal Electrodes and Sub-Micron Lateral Electrode-to-Resonator Gaps (2001)

 

Bonded-Microplatform MEMS/Transistor Merging (2001)

  2001 Conference Publications:

C. T.-C. Nguyen, “RF MEMS for Low-Power Communications,” Extended Abstracts, 2001 Int. Conf. on Solid-State Devices and Materials (SSDM’01), Tokyo, Japan, Sept. 26-28, 2001, pp. 462-463.

C. T.-C. Nguyen, “Transceiver front-end architectures using vibrating micromechanical signal processors (invited),” Dig. of Papers, Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Sept. 12-14, 2001, pp. 23-32.

 C. T.-C. Nguyen, “Vibrating RF MEMS for low power wireless communications (invited keynote),” Proceedings, 2000 Int. MEMS Work sho p (iMEMS’01), Singapore, July 4-6, 2001, pp. 21-34.

S. Lee, M. U. Demirci, and Clark T.-C. Nguyen, “A 10-MHz micromechanical resonator Pierce reference oscillator for communications,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany, June 10-14, 2001 , pp. 1094-1097.

W. -T. Hsu, J. R. Clark, and C. T. -C. Nguyen, “Q-optimized lateral free-free beam micromechanical resonators,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany, June 10-14, 2001, pp. 1110-1113.

W. -T. Hsu, J. R. Clark, and C. T. -C. Nguyen, “A resonant temperature sensor based on electrical spring softening,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transduc­ers’01), Munich, Germany, June 10-14, 2001, pp. 1484-1487.

A.-C. Wong, Y. Xie, and C. T.-C. Nguyen, “A bonded-micro-platform technology for modular merging of RF MEMS and transistor circuits,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany, June 10-14, 2001, pp. 992-995.

J. R. Clark, W.-T. Hsu, and C. T.-C. Nguyen, “Measurement techniques for capacitively-transduced VHF-to-UHF micromechanical resonators,” Digest of Technical Papers, the 11th Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany, June 10-14, 2001, pp. 1118-1121.

R. Navid, J. R. Clark, M. Demirci, and C. T.-C. Nguyen, “Third-order intermodulation distortion in capacitively-driven CC-beam micromechanical resonators,” Technical Digest, 14th Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 228-231.

W.-T. Hsu, J. R. Clark, and C. T.-C. Nguyen, “A sub-micron capacitive gap process for multiple-metal-electrode lateral micromechanical resonators,” Technical Digest, 14th Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 349-352.

 

Y.-T. Cheng, W.-T. Hsu, L. Lin, C. T.-C. Nguyen, and K. Najafi, “Vacuum packaging using localized aluminum/silicon-to-glass bonding,” Technical Digest, 14th Int. IEEE Micro Electro Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25, 2001, pp. 18-21.

 

 

Last Updated Tuesday, Aug. 7, 2012.

Contents copyright @ 2012. All rights reserved.

To report errors, please email: ctnguyen@eecs.berkeley.edu