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Must
Read Papers:
1.51-GHz with Q
>10,000 Even in Air!
A result of
purposely impedance-mismatching a polydiamond disk with its polysilicon stem.
1.2-GHz with Q = 14,600!
Who says diamond is needed to get Q
>10,000 at GHz frequencies? With the right "hollow-disk" ring
design, polysilicon can do even better than diamond.
60-MHz Wine-Glass Disk Oscillator Makes
the GSM Reference Oscillator Spec!
Higher power
handling and a Q >50,000 crucial in making the spec.
Arraying for Impedance <480W at 72MHz!
Mechanically
coupled resonator arrays automatically align resonator frequencies to allow
output summation for low impedance and higher power handling.
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First
Analytical Treatment for Intermodulation Distortion in Capacitively
Transduced Micromechanical Resonators -- not great for the CC-beams of
2001, but much better today (2001)
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The
Latest Award
Winning Papers:
Solid-Gap Vibrating
Micromechanical Resonator Wins
Best Paper Award at the 2005 IEEE Int. Frequency Control Symposium!
Congratulations
to Yu-Wei Lin for winning the Best Frequency Control Paper Award at the 2005
IEEE Int. Frequency Control Symposium.
Chip-Scale Atomic
Clock Overview Paper Wins the Jack Raper Award at the
2005 IEEE Int. Solid-State Circuits Conference!
Congratulations
to all those in the CSAC program (which Prof. Nguyen ran while at DARPA),
especially John Kitching from NIST, who co-authored this paper.
Vibrating RF MEMS Wins
Best Invited Paper Award at the 2004 IEEE Custom Integrated Circuits
Conference!
Read this for an
overview on vibrating RF MEMS.
Resonator Array
Oscillator Wins 2004 UFFC
Symposium Best Frequency Control Paper Award!
Congratulations
to Seungbae Lee for winning the Best Frequency Control Paper Award at the 2004
IEEE Ultrasonics, Ferroelectrics, and Frequency Control 50th Anniv. Joint
Conf.
Ext. Wine-Glass
Resonator Work Wins 2003 IEDM Best Paper Award!
Congratulations
to Yuan Xie for winning the 2003 Int. Electron Devices Meeting Roger A. Haken
Best Student Paper Award.
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Lateral
Free-Free Beam With Metal Electrodes and Sub-Micron Lateral
Electrode-to-Resonator Gaps (2001) |
Bonded-Microplatform
MEMS/Transistor Merging (2001)
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2001
Conference Publications: |
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C.
T.-C. Nguyen, “RF
MEMS for Low-Power Communications,” Extended Abstracts,
2001 Int. Conf. on Solid-State Devices and Materials (SSDM’01),
Tokyo,
Japan, Sept.
26-28, 2001, pp. 462-463.
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C.
T.-C. Nguyen, “Transceiver
front-end architectures using vibrating micromechanical signal
processors (invited),” Dig. of Papers,
Topical Meeting on Silicon Monolithic Integrated Circuits in RF
Systems,
Sept. 12-14, 2001, pp. 23-32.
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C.
T.-C. Nguyen, “Vibrating
RF MEMS for low power wireless communications (invited keynote),” Proceedings,
2000 Int. MEMS Work
sho
p (iMEMS’01), Singapore, July 4-6, 2001, pp. 21-34.
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S.
Lee, M. U. Demirci, and
Clark
T.-C. Nguyen, “A
10-MHz micromechanical resonator Pierce reference oscillator for
communications,”
Digest of Technical Papers, the 11th
Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany, June
10-14, 2001
, pp. 1094-1097.
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W.
-T. Hsu, J. R. Clark, and C. T. -C. Nguyen, “Q-optimized
lateral free-free beam micromechanical resonators,” Digest
of Technical Papers, the 11th Int. Conf. on Solid-State
Sensors & Actuators (Transducers’01), Munich, Germany, June
10-14, 2001, pp. 1110-1113.
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W.
-T. Hsu, J. R. Clark, and C. T. -C. Nguyen, “A
resonant temperature sensor based on electrical spring softening,” Digest of Technical Papers, the 11th Int. Conf. on
Solid-State Sensors & Actuators (Transducers’01), Munich,
Germany, June 10-14, 2001, pp. 1484-1487.
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A.-C.
Wong, Y. Xie, and C. T.-C. Nguyen, “A
bonded-micro-platform technology for modular merging of RF MEMS and
transistor circuits,” Digest of Technical
Papers, the 11th Int. Conf. on Solid-State Sensors &
Actuators (Transducers’01), Munich, Germany, June 10-14, 2001,
pp. 992-995.
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J.
R. Clark, W.-T. Hsu, and C. T.-C. Nguyen, “Measurement
techniques for capacitively-transduced VHF-to-UHF micromechanical
resonators,”
Digest of Technical Papers, the 11th
Int. Conf. on Solid-State Sensors & Actuators (Transducers’01), Munich, Germany, June
10-14, 2001, pp. 1118-1121.
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R.
Navid, J. R. Clark, M. Demirci, and C. T.-C. Nguyen, “Third-order
intermodulation distortion in capacitively-driven CC-beam
micromechanical resonators,” Technical Digest,
14th Int. IEEE Micro Electro Mechanical Systems
Conference, Interlaken, Switzerland, Jan.
21-25, 2001, pp. 228-231.
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W.-T.
Hsu, J. R. Clark, and C. T.-C. Nguyen, “A
sub-micron capacitive gap process for multiple-metal-electrode
lateral micromechanical resonators,” Technical
Digest, 14th Int. IEEE Micro Electro Mechanical Systems
Conference, Interlaken, Switzerland, Jan.
21-25, 2001, pp. 349-352.
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Y.-T.
Cheng, W.-T. Hsu, L. Lin, C. T.-C. Nguyen, and K. Najafi, “Vacuum
packaging using localized aluminum/silicon-to-glass bonding,” Technical Digest, 14th Int. IEEE Micro Electro
Mechanical Systems Conference, Interlaken, Switzerland, Jan. 21-25,
2001, pp. 18-21.
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