The overall group project aims to produce a high-resolution MEMS strain gauge for applications on steel. This particular project will develop a rapid bonding process for installing vacuum sealed MEMS strain sensor modules to steel components. To ensure that the MEMS strain gauge accurately measures the strain within a steel substrate, properties of the bond layer between silicon and steel must be observed and determined. A uniaxial strain rig will be used to measure the Youngs modulus, creep, and hysteresis of silicon-steel bonds within a temperature controlled environment. A mN strain gauge will be used to characterize the shear modulus and strength of microfabricated bonds of various shapes and widths.