Electrical Interconnect of Components Transferred by Fluidic Microassembly Using Capillary Forces

Karen L. Scott and Piotr Prokop
(Professor Roger T. Howe)

The goal of this project is to take the fluidic microassembly technique, developed by Uthara Srinivasan, and extend it such that electrical interconnects can be made between a microcomponent and the substrate.

Send mail to the author : (jhuggins@eecs.berkeley.edu)

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