Ultrasonic Bonding for MEMS Hermetic Packaging and Assembly

Jongbaeg Kim and Mu Chiao
(Professor Liwei Lin --ME)
BSAC

The goal of this project is to develop ultrasonic bonding as a new bonding method for MEMS level hermetic sealing and packaging. We aim to demonstrate the feasibility and find the right bonding conditions and parameter values.


Send mail to the author : (jhuggins@eecs.berkeley.edu)


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