Selective Induction Heating and Bonding

Andrew Cao
(Professor Liwei Lin --ME)
BSAC

The goal of this project is to develop wafer bonding and hermetic sealing technology based on induction heating for MEMS and IC post packaging. We will use induction heating to remotely operate thermal actuators for the MEMS assembly.


Send mail to the author : (jhuggins@eecs.berkeley.edu)


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