Inkjet Printing of Organic Devices

Steve Molesa, Dave Redinger, Frank Liao, and Josephine Lee
(Professor Vivek Subramanian)
DARPA and Semiconductor Research Corporation

Conventional ICs still suffer from certain incremental costs and are limited to silicon substrates, thereby preventing them from becoming more ubiquitous in consumer applications. Organic-based semiconductors have the advantage of being processed in solution allowing for them to be sprayed or dispensed on a plethora of compatible substrates, including paper, plastic, cloth, and glass. While many organic semiconductors so far do not exhibit the same performance as their silicon counterparts, the advantage of solution-based processing can save costs and allow for widespread integration, making them ideal materials for low-cost electronics.

In this work, we are developing the technology to make ASICs for a variety of innovative and integrated applications. Specifically, the work incorporates several areas of development: (1) the inkjet technology for dispensing and patterning the necessary materials; (2) organic-based molecules for the semiconducting material; (3) advanced materials such as nanocrystals to be used for interconnects and dielectrics; and (4) an integrated, additive process that is also substrate tolerant. We have made progress in multiple areas and are developing a fully integrated process for active devices. Such a process would be used to fabricate RF ID tags, chemical sensors, transducers, or displays on flexible and novel substrates, such as plastic or cloth.

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