Spring 2005 On Campus Infosessions/Interviews

1. Microsoft DATE: Monday, January 24, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Infosession TIME: 6:00-8:00pm Sponsored by EECS IPRO & IEEE 2. AMD DATE: Wednesday, January 26, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Infosession TIME: 6:00-8:00pm Sponsored by EECS IPRO & AIChe, EEGSA, SWE 3. Sun DATE: Monday, January 31, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Infosession TIME: 5:00-7:00pm Sponsored by EECS IPRO & SWE 4. Raytheon DATE: Thursday, February 3, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Infosession TIME: 5:00-7:00pm Sponsored by EECS IPRO & IEEE 5. MIT Lincoln Labs DATE: Tuesday, February 8, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Infosession TIME: 7:00pm Sponsored by EECS IPRO 6. Agilent DATE: Wednesday, February 9, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Infosession TIME: 5:00pm Sponsored by EECS IPRO

7. Google DATE: Wednesday, February 16, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Open House TIME: 12:00pm-1:30pm Sponsored by EECS IPRO 8. Microsoftt DATE: Tuesday, February 22, 2005 LOCATION: HP Auditorium, 3rd Floor Soda Hall EVENT: Infosession TIME: 6:30pm Sponsored by EECS IPRO & HKN 9. Amazon DATE: Wednesday, February 23, 2005 LOCATION: HP Auditorium, 3rd Floor Soda Hall EVENT: Infosession TIME: 6:00-8:00pm Sponsored by EECS IPRO & HKN 10. Vmware DATE: Thursday, February 24, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Infosession TIME: 6:00-8:00pm Sponsored by EECS IPRO & HKN EECS Internship Open House DATE: Tuesday, March 1, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Open House TIME: 11:30-2:30pm Sponsored by EECS Student Matters & IPRO 11. KLA-Tencor DATE: Thursday, March 17, 2005 LOCATION: Wozniak Lounge, 4th Floor Soda Hall EVENT: Open House TIME: TBD Sponsored by EECS IPRO & SWE

Interested co-sponsors should email infosessions@eecs from a 'berkeley' address about four weeks prior to infosession date.