Electrical Engineering
      and Computer Sciences

Electrical Engineering and Computer Sciences

COLLEGE OF ENGINEERING

UC Berkeley

A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects

Meriem Ben Salah Ep Akin

EECS Department
University of California, Berkeley
Technical Report No. UCB/EECS-2014-113
May 19, 2014

http://www.eecs.berkeley.edu/Pubs/TechRpts/2014/EECS-2014-113.pdf

Mechanically flexible and one-dimensional electronic interconnects are nowadays a standard, enabling various applications, and offering a wide range of advantages. Taking planar one-dimensional flexible systems onto the next level of high-speed and high performance electronic systems, various efforts on connecting rigid integrated circuits (ICs), e.g. microcontrollers, batteries, sensors, actuators etc., to flexible interconnects exist. In this work, a comprehensive surface mount technology (SMT) for rigid and silicon dioxide based ICs onto flexible and glycol-modified Polyethylene Terephthalate screen-printed interconnects is developed. Here, the SMT solution addresses the following challenges: low thermal budget of Polyethylene Terephthalate, non-solderability of the screen-printed structures, aluminum coating of the IC, and small-sized pitches of the IC. Besides, various reliability aspects of the assembled electrical end product are investigated.

Advisor: Ana Claudia Arias


BibTeX citation:

@mastersthesis{Ben Salah Ep Akin:EECS-2014-113,
    Author = {Ben Salah Ep Akin, Meriem},
    Editor = {Arias, Ana Claudia},
    Title = {A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects},
    School = {EECS Department, University of California, Berkeley},
    Year = {2014},
    Month = {May},
    URL = {http://www.eecs.berkeley.edu/Pubs/TechRpts/2014/EECS-2014-113.html},
    Number = {UCB/EECS-2014-113},
    Abstract = {Mechanically flexible and one-dimensional electronic interconnects are nowadays a standard, enabling various applications, and offering a wide range of advantages. Taking planar one-dimensional flexible systems onto the next level of high-speed and high performance electronic systems, various efforts on connecting rigid integrated circuits (ICs), e.g. microcontrollers, batteries, sensors, actuators etc., to flexible interconnects exist. In this work, a comprehensive surface mount technology (SMT) for rigid and silicon dioxide based ICs onto flexible and glycol-modified Polyethylene Terephthalate screen-printed interconnects is developed. Here, the SMT solution addresses the following challenges: low thermal budget of Polyethylene Terephthalate, non-solderability of the screen-printed structures, aluminum coating of the IC, and small-sized pitches of the IC. Besides, various reliability aspects of the assembled electrical end product are investigated.}
}

EndNote citation:

%0 Thesis
%A Ben Salah Ep Akin, Meriem
%E Arias, Ana Claudia
%T A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects
%I EECS Department, University of California, Berkeley
%D 2014
%8 May 19
%@ UCB/EECS-2014-113
%U http://www.eecs.berkeley.edu/Pubs/TechRpts/2014/EECS-2014-113.html
%F Ben Salah Ep Akin:EECS-2014-113