Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices

Joanna Lai

EECS Department
University of California, Berkeley
Technical Report No. UCB/EECS-2008-173
December 19, 2008

http://www.eecs.berkeley.edu/Pubs/TechRpts/2008/EECS-2008-173.pdf

Advisor: Tsu-Jae King Liu


BibTeX citation:

@phdthesis{Lai:EECS-2008-173,
    Author = {Lai, Joanna},
    Title = {Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices},
    School = {EECS Department, University of California, Berkeley},
    Year = {2008},
    Month = {Dec},
    URL = {http://www.eecs.berkeley.edu/Pubs/TechRpts/2008/EECS-2008-173.html},
    Number = {UCB/EECS-2008-173}
}

EndNote citation:

%0 Thesis
%A Lai, Joanna
%T Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices
%I EECS Department, University of California, Berkeley
%D 2008
%8 December 19
%@ UCB/EECS-2008-173
%U http://www.eecs.berkeley.edu/Pubs/TechRpts/2008/EECS-2008-173.html
%F Lai:EECS-2008-173