Electrical Engineering
      and Computer Sciences

Electrical Engineering and Computer Sciences

COLLEGE OF ENGINEERING

UC Berkeley

Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices

Joanna Lai

EECS Department
University of California, Berkeley
Technical Report No. UCB/EECS-2008-173
December 19, 2008

http://www.eecs.berkeley.edu/Pubs/TechRpts/2008/EECS-2008-173.pdf

Advisor: Tsu-Jae King Liu


BibTeX citation:

@phdthesis{Lai:EECS-2008-173,
    Author = {Lai, Joanna},
    Title = {Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices},
    School = {EECS Department, University of California, Berkeley},
    Year = {2008},
    Month = {Dec},
    URL = {http://www.eecs.berkeley.edu/Pubs/TechRpts/2008/EECS-2008-173.html},
    Number = {UCB/EECS-2008-173}
}

EndNote citation:

%0 Thesis
%A Lai, Joanna
%T Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices
%I EECS Department, University of California, Berkeley
%D 2008
%8 December 19
%@ UCB/EECS-2008-173
%U http://www.eecs.berkeley.edu/Pubs/TechRpts/2008/EECS-2008-173.html
%F Lai:EECS-2008-173