Full profile chemical mechanical polishing (CMP) metrology

Runzi Chang

EECS Department
University of California, Berkeley
Technical Report No. UCB/ERL M01/23
May 2001

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/ERL-01-23.pdf

BibTeX citation:

@mastersthesis{Chang:M01/23,
    Author = {Chang, Runzi},
    Title = {Full profile chemical mechanical polishing (CMP) metrology},
    School = {EECS Department, University of California, Berkeley},
    Year = {2001},
    Month = {May},
    URL = {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/9584.html},
    Number = {UCB/ERL M01/23}
}

EndNote citation:

%0 Thesis
%A Chang, Runzi
%T Full profile chemical mechanical polishing (CMP) metrology
%I EECS Department, University of California, Berkeley
%D 2001
%@ UCB/ERL M01/23
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/9584.html
%F Chang:M01/23