Electrical Engineering
      and Computer Sciences

Electrical Engineering and Computer Sciences

COLLEGE OF ENGINEERING

UC Berkeley

Metal Vapor Vacuum Arc Ion Implantation for Seeding of Electroless Cu Plating

X.Y. Qian, M.H. Kiang, Nathan W. Cheung, I.G. Brown, X. Godechot, J.E. Galvin, R.A. MacGill and K.M. Yu

EECS Department
University of California, Berkeley
Technical Report No. UCB/ERL M90/82
1990


BibTeX citation:

@techreport{Qian:M90/82,
    Author = {Qian, X.Y. and Kiang, M.H. and Cheung, Nathan W. and Brown, I.G. and Godechot, X. and Galvin, J.E. and MacGill, R.A. and Yu, K.M.},
    Title = {Metal Vapor Vacuum Arc Ion Implantation for Seeding of Electroless Cu Plating},
    Institution = {EECS Department, University of California, Berkeley},
    Year = {1990},
    URL = {http://www.eecs.berkeley.edu/Pubs/TechRpts/1990/1578.html},
    Number = {UCB/ERL M90/82}
}

EndNote citation:

%0 Report
%A Qian, X.Y.
%A Kiang, M.H.
%A Cheung, Nathan W.
%A Brown, I.G.
%A Godechot, X.
%A Galvin, J.E.
%A MacGill, R.A.
%A Yu, K.M.
%T Metal Vapor Vacuum Arc Ion Implantation for Seeding of Electroless Cu Plating
%I EECS Department, University of California, Berkeley
%D 1990
%@ UCB/ERL M90/82
%U http://www.eecs.berkeley.edu/Pubs/TechRpts/1990/1578.html
%F Qian:M90/82