Electrical Engineering
      and Computer Sciences

Electrical Engineering and Computer Sciences

COLLEGE OF ENGINEERING

UC Berkeley

Planar Multilevel Metallization Using Additive Pattern Transfer

D.E. Lyons

EECS Department
University of California, Berkeley
Technical Report No. UCB/ERL M89/75
1989


BibTeX citation:

@techreport{Lyons:M89/75,
    Author = {Lyons, D.E.},
    Title = {Planar Multilevel Metallization Using Additive Pattern Transfer},
    Institution = {EECS Department, University of California, Berkeley},
    Year = {1989},
    URL = {http://www.eecs.berkeley.edu/Pubs/TechRpts/1989/1264.html},
    Number = {UCB/ERL M89/75}
}

EndNote citation:

%0 Report
%A Lyons, D.E.
%T Planar Multilevel Metallization Using Additive Pattern Transfer
%I EECS Department, University of California, Berkeley
%D 1989
%@ UCB/ERL M89/75
%U http://www.eecs.berkeley.edu/Pubs/TechRpts/1989/1264.html
%F Lyons:M89/75