Articles in journals or magazines
L. Wang, P. K. Chu, A. Anders, and N. W. Cheung, "Effects of ozone oxidation on interfacial and dielectric properties of thin HfO_2 films ," J. Applied Physics , vol. 104, no. 5, pp. 054117-1-4, Sep. 2008.
H. Y. Jin and N. W. Cheung, "Forming gas annealing characteristics of germanium-on-insulator substrates ," IEEE Electron Device Letters , vol. 29, no. 7, pp. 674-676, July 2008.
H. Y. Jin and N. W. Cheung, "A new method to extract bulk carrier mobility in germanium-on-insulator ," IEEE Trans. Electron Devices , vol. 55, no. 5, pp. 1250-1254, May 2008.
N. Misra, L. Xu, Y. Pan, and N. W. Cheung, "Excimer laser annealing of silicon nanowires ," Applied Physics Letters , vol. 90, no. 11, pp. 111111-1-3, March 2007.
N. Misra, Y. Pan, N. W. Cheung, and C. P. Grigoropoulos, "Selective processing of semiconductor nanowires by polarized visible radiation ," Applied Physics A: Materials Science & Processing , vol. 90, no. 2, pp. 219-223, Feb. 2007.
Technical Reports
N. W. Cheung, M. A. Lieberman, C. Pico, R. Stewart, J. Tao, M. Kiang, C. Yu, V. Vahedi, B. Troyanovsky, W. En, E. Jones, and J. Benasso, "Plasma Immersion Ion Implantation (PIII) for Integrated Circuit Manufacturing: Fourth Quarterly Progress Report ," EECS Department, University of California, Berkeley, Tech. Rep. UCB/ERL M91/116, Sep. 1991.
N. W. Cheung, M. A. Lieberman, C. Pico, R. Stewart, J. Tao, M. Kiang, C. Yu, V. Vahedi, B. Troyanovsky, W. En, E. Jones, and J. Benasso, "Plasma Immersion Ion Implantation (PIII) for Integrated Circuit Manufacturing: Third Quarterly Progress Report ," EECS Department, University of California, Berkeley, Tech. Rep. UCB/ERL M91/86, June 1991.
N. Cheung, M. A. Lieberman, C. Pico, R. Stewart, J. Tao, M. Kiang, C. Yu, V. Vahedi, B. Troyanovsky, W. En, E. Jones, and J. Benasso, "Plasma Immersion Ion Implantation (PIII) for Integrated Circuit Manufacturing: Second Quarterly Progress Report ," EECS Department, University of California, Berkeley, Tech. Rep. UCB/ERL M91/63, June 1991.
M. A. Lieberman and N. W. Cheung, "Plasma Immersion Ion Implantation (PIII) for Integrated Circuit Manufacturing ," EECS Department, University of California, Berkeley, Tech. Rep. UCB/ERL M91/26, April 1991.
R. Stewart, X. Qian, D. Carl, B. Lake, Jr., J. Benasso, R. Lynch, C. Pico, M. A. Lieberman, and N. W. Cheung, "Characterization of the Processing Plasma in an Engineering Prototype Reactor for Plasma Immersion Ion Implantation ," EECS Department, University of California, Berkeley, Tech. Rep. UCB/ERL M90/100, Nov. 1990.
X. Qian, N. W. Cheung, and M. A. Lieberman, "Plasma Immersion Ion Implantation for VLSI Fabrication ," EECS Department, University of California, Berkeley, Tech. Rep. UCB/ERL M90/84, Sep. 1990.
X. Qian, M. Kiang, N. W. Cheung, I. Brown, X. Godechot, J. Galvin, R. MacGill, and K. Yu, "Metal Vapor Vacuum Arc Ion Implantation for Seeding of Electroless Cu Plating ," EECS Department, University of California, Berkeley, Tech. Rep. UCB/ERL M90/82, Sep. 1990.
H. Wong, X. Qian, D. Carl, N. W. Cheung, M. A. Lieberman, I. Brown, and K. Yu, "Plasma Immersion Ion Implantation for Impurity Gettering in Silicon Plasma Immersion Ion Implantation and Dose Loss in Impurity Gettering Experiment ," EECS Department, University of California, Berkeley, Tech. Rep. UCB/ERL M90/23, March 1990.
B. Liew, P. Fang, N. W. Cheung, and C. Hu, "BERT - Circuit Electromigration Simulator ," EECS Department, University of California, Berkeley, Tech. Rep. UCB/ERL M90/3, Jan. 1990.
Patents
F. J. Henley and N. W. Cheung, "Controlled process and resulting device ," U.S. Patent 7,410,887. Aug. 2008.
F. J. Henley and N. W. Cheung, "Controlled cleaving process ," U.S. Patent 7,371,660. May 2008.
F. J. Henley and N. W. Cheung, "Method and device for controlled cleaving process ," U.S. Patent 7,348,258. March 2008.
J. A. Chediak, Z. Luo, T. D. Sands, N. W. Cheung, L. P. Lee, and J. Seo, "Integrated, fluorescence-detecting microanalytical system ," U.S. Patent 7,221,455. May 2007.
F. J. Henley and N. W. Cheung, "Controlled cleaving process ," U.S. Patent 7,160,790. Jan. 2007.
F. J. Henley and N. W. Cheung, "Gettering technique for wafers made using a controlled cleaving process ," U.S. Patent 6,890,838. May 2005.
F. J. Henley and N. W. Cheung, "Method and device for controlled cleaving process ," U.S. Patent 6,790,747. Sep. 2004.
F. J. Henley and N. W. Cheung, "Controlled cleaving process ," U.S. Patent 6,632,724. Oct. 2003.
F. J. Henley and N. Cheung, "Controlled cleaving process using pressurized fluid ," U.S. Patent 6,582,999. June 2003.
F. J. Henley and N. W. Cheung, "Silicon-on-silicon hybrid wafer assembly ," U.S. Patent 6,558,802. May 2003.
F. J. Henley and N. W. Cheung, "Gettering technique for wafers made using a controlled cleaving process ," U.S. Patent 6,548,382. April 2003.
N. W. Cheung, W. G. En, S. N. Farrens, and M. Korolik, "Method for fabricating multi-layered substrates ," U.S. Patent 6,534,381. March 2003.
F. J. Henley and N. Cheung, "Controlled cleavage process and device for patterned films ," U.S. Patent 6,528,391. March 2003.
F. J. Henley and N. Cheung, "Controlled cleavage process using pressurized fluid ," U.S. Patent 6,511,899. Jan. 2003.
F. J. Henley and N. W. Cheung, "Method and device for controlled cleaving process ," U.S. Patent 6,486,041. Nov. 2002.
F. J. Henley and N. W. Cheung, "Controlled cleavage process and resulting device using beta annealing ," U.S. Patent 6,458,672. Oct. 2002.
N. W. Cheung, T. D. Sands, and W. S. Wong, "Separation of thin films from transparent substrates by selective optical processing ," U.S. Patent 6,420,242. July 2002.
N. W. Cheung and F. J. Henley, "Generic layer transfer methodology by controlled cleavage process ," U.S. Patent 6,391,740. May 2002.
N. W. Cheung and F. J. Henley, "Generic layer transfer methodology by controlled cleavage process," U.S. Patent Application. March 2002.
N. W. Cheung, X. Lu, and C. Hu, "Method of separating films from bulk substrates by plasma immersion ion implantation ," U.S. Patent 6,344,404. Feb. 2002.
N. W. Cheung, T. D. Sands, and W. S. Wong, "Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials ," U.S. Patent 6,335,263. Jan. 2002.
F. J. Henley and N. W. Cheung, "Controlled cleavage thin film separation process using a reusable substrate ," U.S. Patent 6,335,264. Jan. 2002.
F. J. Henley and N. Cheung, "Clustertool system software using plasma immersion ion implantation ," U.S. Patent 6,321,134. Nov. 2001.
F. J. Henley and N. Cheung, "Clustertool system software using plasma immersion ion implantation," U.S. Patent Application. Oct. 2001.
F. J. Henley and N. W. Cheung, "Pre-semiconductor process implant and post-process film separation ," U.S. Patent 6,291,326. Sep. 2001.
F. J. Henley and N. Cheung, "Method and resulting device for manufacturing for double gated transistors," U.S. Patent Application. Sep. 2001.
F. J. Henley and N. Cheung, "Method and device for controlled cleaving process ," U.S. Patent 6,291,313. Sep. 2001.
F. J. Henley and N. W. Cheung, "Method and device for controlled cleaving process ," U.S. Patent 6,284,631. Sep. 2001.
F. J. Henley and N. W. Cheung, "Controlled cleavage process using patterning ," U.S. Patent 6,290,804. Sep. 2001.
F. J. Henley and N. W. Cheung, "Controlled cleavage process and device for patterned films using a release layer ," U.S. Patent 6,291,314. Sep. 2001.
F. J. Henley and N. W. Cheung, "Cleaved silicon thin film with rough surface ," U.S. Patent 6,294,814. Sep. 2001.
F. J. Henley, N. Cheung, W. G. Eng, and I. J. Malik, "Wafer edge engineering method and device ," U.S. Patent 6,265,328. July 2001.
F. J. Henley and N. W. Cheung, "Economical silicon-on-silicon hybrid wafer assembly ," U.S. Patent 6,245,161. June 2001.
F. J. Henley and N. W. Cheung, "Controlled cleavage using patterning," U.S. Patent Application. June 2001.
F. J. Henley and N. W. Cheung, "Controlled cleavage process and device for patterned films using patterned implants ," U.S. Patent 6,248,649. June 2001.
N. W. Cheung, X. Lu, and C. Hu, "Method of separating films from bulk substrates by plasma immersion ion implantation," U.S. Patent Application. May 2001.
F. J. Henley and N. Cheung, "Cluster tool apparatus using plasma immersion ion implantation ," U.S. Patent 6,207,005. March 2001.
F. J. Henley and N. W. Cheung, "Pre-semiconductor process implant and post-process film separation," U.S. Patent Application. Feb. 2001.
F. J. Henley and N. W. Cheung, "Pre-semiconductor process implant and post-process film separation ," U.S. Patent 6,184,111. Feb. 2001.
F. J. Henley and N. Cheung, "Device for patterned films ," U.S. Patent 6,187,110. Feb. 2001.
F. J. Henley and N. W. Cheung, "Silicon-on-silicon wafer bonding process using a thin film blister-separation method ," U.S. Patent 6,159,824. Dec. 2000.
F. J. Henley and N. W. Cheung, "Controlled cleavage thin film separation process using a reusable substrate ," U.S. Patent 6,159,825. Dec. 2000.
F. J. Henley and N. Cheung, "Controlled cleavage system using pressurized fluid ," U.S. Patent 6,155,909. Dec. 2000.
F. J. Henley and N. W. Cheung, "Controlled cleavage process and resulting device using beta annealing ," U.S. Patent 6,162,705. Dec. 2000.
F. J. Henley and N. W. Cheung, "Pressurized microbubble thin film separation process using a reusable substrate ," U.S. Patent 6,146,979. Nov. 2000.
F. J. Henley and N. Cheung, "Cluster tool method using plasma immersion ion implantation ," U.S. Patent 6,153,524. Nov. 2000.
F. J. Henley and N. Cheung, "Planarizing technique for multilayered substrates ," U.S. Patent 6,103,599. Aug. 2000.
F. J. Henley and N. W. Cheung, "Gettering technique for silicon-on-insulator wafers ," U.S. Patent 6,083,324. July 2000.
N. W. Cheung, T. D. Sands, and W. S. Wong, "Separation of thin films from transparent substrates by selective optical processing ," U.S. Patent 6,071,795. June 2000.
F. J. Henley and N. W. Cheung, "Silicon-on-silicon hybrid wafer assembly ," U.S. Patent 6,048,411. April 2000.
F. J. Henley and N. W. Cheung, "Method for controlled cleaving process ," U.S. Patent 6,033,974. March 2000.
N. W. Cheung, X. Lu, and C. Hu, "Method of separating films from bulk substrates by plasma immersion ion implantation ," U.S. Patent 6,027,988. Feb. 2000.
F. J. Henley and N. W. Cheung, "Reusable substrate for thin film separation ," U.S. Patent 6,010,579. Jan. 2000.
F. J. Henley and N. W. Cheung, "Controlled cleaving process ," U.S. Patent 6,013,563. Jan. 2000.
F. J. Henley and N. Cheung, "Controlled cleavage process using pressurized fluid ," U.S. Patent 6,013,567. Jan. 2000.
F. J. Henley and N. Cheung, "Controlled cleavage process using pressurized fluid ," U.S. Patent 5,994,207. Nov. 1999.
F. J. Henley and N. Cheung, "Controlled cleavage process and device for patterned films ," U.S. Patent 5,985,742. Nov. 1999.