Electrical Engineering
      and Computer Sciences

Electrical Engineering and Computer Sciences

COLLEGE OF ENGINEERING

UC Berkeley

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SAMPLE-3D 2.0

SAMPLE-3D version 2.0 is a program for simulating lithography and topography in three dimensions. The principal components of SAMPLE-3D are SPLAT for aerial image calculation, BLEACH for exposure simulation, DEVELOP and CRATER for development, and NETCH for etching and deposition simulation. The release also includes 2D and 3D plotting programs, and a miscellany of utility software.

This version of SAMPLE-3D is similar to version 1.0, but now has the capability of simulating pattern transfer through the use of NETCH. NETCH is a triangular facet advancement program capable of simulating wet and dry etching and deposition in integrated circuit processing. Furthermore, a new utility that converts surfaces obtained by running SAMPLE-3D into solids in a format compatible with FastCap has been added. The lithography capabilities have also been improved. Finally, a new version of SPLAT, SPLAT version 5.0, capable of generating aerial images within thin films is now included as part of the SAMPLE-3D package.

The new version of SAMPLE-3D comes without the GUI; the user must execute the program by supplying an input deck containing the commands to be executed.

SPLAT 5.0 and SAMPLE 1.8 codes are included as part of this current release of SAMPLE-3D. However, the SPLAT and SAMPLE User's Guides must be ordered separately.

Documentation Included with the Program:

  1. User's Guide with Installation Notes. Available separately for $5.00

Additional Documentation Available:

Special Licensing/Distribution Restrictions: