Syllabus For Preliminary Examinations
In Semiconductor Process Technology
Reviewed May 2010
This examination will cover major EE143 and EE243 course topics and their prerequisites,
including front-end of the line modules (oxidation, implantation, dopant diffusion),
patterning (lithography, etching), thin-film deposition (CVD, PVD), back-end
of the line modules (metallization, CMP) and process integration issues. In
addition, this examination will address basic experimental design techniques
and basic statistical process control principles, as applied in the manufacture
of integrated circuits.
- Basic IC Processing
All chapters of R.C. Jaeger, "Introduction to Microelectronic Fabrication,"
Second Edition, Prentice Hall.
- In depth discussion on Diffusion, Implantation, Etching, Thin Film, Back-End
and Process Integration
Chapters 2, 6, 7, 8, 9 and 11 from "Silicon VLSI Technology," Plummer, Deal,
and Griffin, First Edition, 2000, Prentice Hall.
- In depth discussion on Lithography
Chapter 5 from "Silicon VLSI Technology," Plummer, Deal, and Griffin, First
Edition, 2000, Prentice Hall.
Chapter 2, "Microlithography, Science and Technology", Sheats and Smith, First
Edition 1998, Marcel and Dekker
- Basic Experimental Design and Statistical Process Control
"Fundamentals of Semiconductor Manufacturing and Process Control," by
May and Spanos, Wiley-Interscience, 2006
184.108.40.206, 4.2, 4.3, 4.4 (Basic statistics with emphasis on normal distributions)
6.1, 6.2, 6.4.1, 6.4.3 (Univariate SPC)
7.1 7.2 (Analysis of Variance)
7.3.1. (2-level Factorials)
NOTE: The following courses may not be used to fulfill the prelim breadth
requirement if you take the Semiconductor Processing prelim: EECS 130, 143,
231, 243, 290H