Integration and Assembly Technologies for Microsystems

EECS Joint Colloquium Distinguished Lecture Series

pic of Roger Howe

Professor Roger T. Howe
2000 Recipient, EECS Outstanding Teaching Award
Berkeley Sensor and Actuator Center, U.C. Berkeley

Wednesday, February 14, 2001
Hewlett Packard Auditorium, 306 Soda Hall
4:00-5:00 p.m.


My talk will discuss current research in the fabrication technologies to make the final "S" in MEMS (it stands for "Systems") a reality. These processes either use unmodified CMOS wafers as the starting material, or use micromachined fragments of CMOS as microsystems components. The range of processes that are compatible with CMOS post-processing has expanded recently, with the addition of LPCVD poly-SiGe as a promising microstructural material to existing capabilities in dry etching of the silicon substrate. Microassembly processes are mandatory for microsystems that combine silicon, opto-electronic, micromechanical, and even microfluidic components. Major hurdles that must be addressed are the need for high-quality mechanical and electrical interfaces after assembly.