SELECTED PUBLICATIONS
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• T.-J. King, M. G. Hack, and I-W. Wu, "Effective density-of-states distributions for accurate modeling of polycrystalline-silicon thin-film transistors," Journal of Applied Physics, Vol. 75, No. 2, pp. 908-913, 1994.
• Y.-J. Tung, P. G. Carey, P. M. Smith, S. D. Theiss, X. Meng, R. Weiss, G. A. Davis, V. Aebi, and T.-J. King, “An ultra-low-temperature-fabricated poly-Si TFT with stacked composite ECR-PECVD gate oxide,” SID International Symposium Digest of Technical Papers, Vol. 29, pp. 887-890, 1998.
• Y.-J. Tung, J. Boyce, J. Ho, X. Huang, and T.-J. King, “A comparative study of hydrogen and deuterium plasma treatment effects on the performance and reliability of polysilicon TFTs,” presented at the 56th Annual Device Research Conference (Charlottesville, Virginia, USA), June 1998.
• S. D. Theiss, P. G. Carey, P. M. Smith, P. Wickboldt, T. W. Sigmon, Y.-J. Tung, and T.-J. King, “Polysilicon thin film transistors fabricated at 100^oC on a flexible plastic substrate,” International Electron Devices Meeting Technical Digest, pp. 257-260, 1998.
• T.-J. King, “Poly-Si TFT technologies for future flat-panel displays,” Information Display, Vol. 17, No. 4, pp. 24-26, 2001.
• D. Good, P. Wickboldt, and T.-J. K. Liu, “Defect passivation in poly-Si TFTs by ion implantation and pulsed laser annealing,” IEEE Electron Device Letters, Vol. 27, No. 10, pp. 840-842, 2006.
• J. Lai and T.-J. K. Liu, “Defect passivation by selenium ion implantation for poly-Si thin film transistors,” IEEE Electron Device Letters, Vol. 28, No. 8, pp. 725-727, 2007.

• T.-J. King, J. R. Pfiester, and K. C. Saraswat, "A variable-work-function polycrystalline-Si_1-xGe_x gate material for submicrometer CMOS technologies," IEEE Electron Device Letters, Vol. 12, No. 10, pp. 533-535, 1991.
• T.-J. King, J. P. McVittie, K. C. Saraswat, and J. R. Pfiester, "Electrical properties of heavily doped polycrystalline silicon-germanium films," IEEE Transactions on Electron Devices, Vol. 41, No. 2, pp. 228-232, 1994.
• T.-J. King and K. C. Saraswat, "Deposition and properties of low-pressure chemical-vapor deposited polycrystalline silicon-germanium films," Journal of the Electrochemical Society, Vol. 141, No. 8, pp. 2235-2241, 1994.
• Best Student Paper Award: W.-C. Lee, A. Wang, T.-J. King, and C. Hu, “Impact of poly-Si_0.8Ge_0.2-gate technology on device performance and reliability,” Proceedings of the 1997 International Semiconductor Device Research Symposium, pp. 513-516, 1997.
• W.-C. Lee, T.-J. King, and C. Hu, "Investigation of poly-Si_1-xGe_x for dual gate CMOS technology," IEEE Electron Device Letters, Vol. 19, No. 7, pp. 247-249, 1998.
• Q. Lu, Y. C. Yeo, P. Ranade, H. Takeuchi, T.-J. King, and C. Hu, “Dual-metal gate technology for deep-submicron CMOS transistors,” 2000 Symposium on VLSI Technology, Digest of Technical Papers, pp. 72-73, 2000.
• Q. Lu, R. Lin, P. Ranade, Y. C. Yeo, X. Meng, H. Takeuchi, T.-J. King, C. Hu, H. Luan, S. Lee, W. Bai, C.-H. Lee, D.-L. Kwong, X. Guo, X. Wang, and T.-P. Ma, “Molybdenum metal gate MOS technology for post-SiO₂ gate dielectrics,” International Electron Devices Meeting Technical Digest, pp. 641-644, 2000.
• Q. Lu, R. Lin, P. Ranade, T.-J. King, and C. Hu, “Metal gate work function adjustment for future CMOS technology,” 2001 Symposium on VLSI Technology, Digest of Technical Papers, pp. 45-46, 2001.
• Y.-C. Yeo, P. Ranade, Q. Lu, R. Lin, T.-J. King, and C. Hu, “Effects of high-k dielectrics on the workfunctions of metal and silicon gates,” 2001 Symposium on VLSI Technology, Digest of Technical Papers, pp. 49-50, 2001.
• Y.-K. Choi, T.-J. King, and C. Hu, “A spacer patterning technology for nanoscale CMOS,” IEEE Transactions on Electron Devices, Vol. 49, No. 3, pp. 436-441, 2002.
• I. Polishchuk P. Ranade, T.-J. King, and C. Hu, “Dual work function metal gate CMOS transistors by Ni-Ti interdiffusion,” IEEE Electron Device Letters, Vol. 23, No. 4, pp. 200-202, 2002.  
• Q. Lu, H. Takeuchi, X. Meng, T.-J. King, C. Hu, K. Onishi, H.-J. Cho, and J. Lee, “Improved performance of ultra-thin HfO₂ CMOSFETs using poly-SiGe gate,” presented at the 2002 VLSI Symposium on Technology (Honolulu, Hawaii, USA), June 2002.
• P. Ranade, Y.-K. Choi, D. Ha, A. Agarwal, M. Ameen, and T.-J. King, "Tunable-work-function Molybdenum gate technology for FDSOI-CMOS," International Electron Devices Meeting Technical Digest, pp. 363-366, December 2002.
• H. Takeuchi and T.-J. King, “Scaling limits of hafnium-silicate films for CMOS gate-dielectric application,” Applied Physics Letters, Vol. 83, No. 4, pp. 788-790, July 2003.
• A. Yagishita, T.-J. King, and J. Bokor, "Schottky barrier height reduction and drive current improvement in metal source/drain MOSFET with strained-Si channel," Extended Abstracts of the 2003 International Conference on Solid-State Devices and Materials, pp. 708-709.
• D. Ha, H. Takeuchi, Y.-K. Choi, and T.-J. King, “Molybdenum gate technology for ultra-thin-body MOSFETs and FinFETs,” IEEE Transactions on Electron Devices, Vol. 51, No. 12, pp. 1989-1996, 2004.
• H. Takeuchi, H. Y. Wong, D. Ha, and T.-J. King, “Impact of oxygen vacancies on high-k gate dielectric engineering,” International Electron Devices Meeting Technical Digest, pp. 829-832, 2004.
• H. Y. Wong, H. Takeuchi, T.-J. King, M. Ameen, and A. Agarwal, “Elimination of poly-Si gate depletion for sub-65nm CMOS technologies by excimer laser annealing,” IEEE Electron Device Letters, Vol. 26, No. 4, pp. 234-236, 2005.
• X. Sun and T.-J. K. Liu, "Spacer gate lithography for reduced variability due to line edge roughness," IEEE Transactions on Semiconductor Manufacturing, Vol. 23, No. 2, pp. 311-315, 2010.
• N. Xu, N. Damrongplasit, H. Takeuchi, R.J. Stephenson, N.W. Cody, A. Yiptong, X. Huang, M. Hytha, R. Mears, and T.-J. K. Liu, "MOSFET performance and scalability enhancement by insertion of oxygen layers," presented at the 2012 IEEE International Electron Devices Meeting (San Francisco, California, USA), December 2012.

• B. Yu, Y.-J. Tung, S. Tang, E. Hui, T.-J. King, and C. Hu, “Ultra-thin-body silicon-on-insulator MOSFET’s for terabit-scale integration,” Proceedings of the 1997 International Semiconductor Device Research Symposium, pp. 623-626, 1997.
• 2002 EDS Paul Rappaport Award: Y. C. Yeo, V. Subramanian, J. Kedzierski, P. Xuan, T.-J. King, J. Bokor, and C. Hu, “Nanoscale ultra-thin-body silicon-on-insulator P-MOSFET with a SiGe/Si heterostructure channel,” IEEE Electron Device Letters, Vol. 21, No. 4, pp. 161-163, 2000.
• D. Hisamoto, W.-C. Lee, J. Kedzierski, H. Takeuchi, K. Asano, C. Kuo, E. Anderson, T.-J. King, J. Bokor, and C. Hu, “FinFET -- a self-aligned double-gate MOSFET scalable to 20 nm,” IEEE Transactions on Electron Devices, Vol. 47, No. 12, pp. 2320-2325, 2000.
• Y.-K. Choi, Y.-C. Jeon, P. Ranade, H. Takeuchi, T.-J. King, J. Bokor, and C. Hu, “30nm ultra-thin-body SOI MOSFET with selectively deposited Ge raised S/D,” 58th Annual Device Research Conference Digest, pp. 23-24, 2000.
• J. Kedzierski, P. Xuan, E. H. Anderson, J. Bokor, T.-J. King, and C. Hu, "Complementary silicide source/drain thin-body MOSFETs for the 20nm gate length regime,” International Electron Devices Meeting Technical Digest, pp. 57-60, 2000.
• N. Lindert, Y.-K. Choi, L. Chang, E. Anderson, W.-C. Lee, T.-J. King, J. Bokor, and C. Hu, “Quasi-planar NMOS FinFETs with sub-100nm gate lengths,” presented at the 59th Annual Device Research Conference (Notre Dame, Indiana, USA), June 2001.
• Y.-K. Choi, N. Lindert, P. Xuan, S. Tang, D. Ha, E. Anderson, T.-J. King, J. Bokor, and C. Hu, "Sub-20nm CMOS FinFET technologies,” International Electron Devices Meeting Technical Digest, pp. 421-424, 2001.
• B. Yu, L. Chang, S. Ahmed, H. Wang, S. Bell, C.-Y. Yang, C. Tabery, C. Hu, T.-J. King, J. Bokor, M.-R. Lin, and D. Kyser, "FinFET scaling: towards 10nm gate length," International Electron Devices Meeting Technical Digest, pp. 251-254, 2002.
• P. Ranade, Y.-K. Choi, D. Ha, A. Agarwal, M. Ameen, and T.-J. King, "Tunable-work-function molybdenum gate technology for FDSOI-CMOS," International Electron Devices Meeting Technical Digest, pp. 363-366, 2002.
• Y.-K. Choi, L. Chang, P. Ranade, J. Lee, D. Ha, S. Balasubramanian, A. Agarwal, T.-J. King, and J. Bokor "FinFET process refinements for improved mobility and gate work function engineering," International Electron Devices Meeting Technical Digest, pp. 259-262, 2002.
• Invited: L. Chang, Y.-K. Choi, D. Ha, P. Ranade, S. Xiong, J. Bokor, C. Hu, and T.-J. King, “Extremely scaled silicon nano-CMOS devices,” Proceedings of the IEEE, Vol. 91, No. 11, pp. 1860-1873, 2003.
• Y.-K. Choi, D. Ha, J. Bokor, and T.-J. King, “Reliability study of CMOS FinFETs,” International Electron Devices Meeting Technical Digest, pp. 177-180, 2003.
• J. Fossum, M. M. Chowdhury, V. P. Trivedi, T.-J. King, Y.-K. Choi, J. An, and B. Yu, “Physical insights on design and modeling of nanoscale FinFETs,” International Electron Devices Meeting, pp. 679-283, 2003.
• W. Xiong, G. Gebara, J. Zaman, M. Gostkowski, B. Nguyen, G. Smith, D. Lewis, C. R. Cleavelin, R. Wise, S. Yu, M. Pas, T.-J. King, and J. P. Colinge, “Improvement of FinFET electrical characteristics by hydrogen annealing,” IEEE Electron Device Letters, Vol. 25, No. 8, pp. 541-543, 2004.
• S. Balasubramanian, J. L. Garrett, V. Vidya, B. Nikolic, and T.-J. King, “Energy-delay optimization of thin-body MOSFETs for the sub-15nm regime,” 2004 IEEE International SOI Conference Digest, pp. 27-29, 2004.
• D. Ha, H. Takeuchi, Y.-K. Choi, T.-J. King, W. Bai, D.-L. Kwong, A. Agarwal, and M. Ameen, “Molybdenum-gate HfO₂ CMOS FinFET technology,” International Electron Devices Meeting Technical Digest, pp. 643-646, 2004.
• Best Paper Award: Z. Guo, S. Balasubramanian, R. Zlatanovici, T.-J. King, and Borivoje Nikolic, “FinFET-based SRAM design,” presented at the International Symposium on Low Power Electronics and Design (San Diego, California, USA), pp. 2-7, August 2005.
• V. Vidya and T.-J. K. Liu, “V_T adjustment by L_eff engineering for LSTP single gate work-function CMOS FinFET technology,” presented at the 16th Biennial University Government Industry Microelectronics Symposium (San Jose, California, USA), June 2006.
• W. Xiong, C. R. Cleavelin, P. Kohli, C. Huffman, T. Schulz, K. Schruefer, G. Gebara, K. Mathews, P. Patruno, I. Cayrefourcq, M. Kennard, C. Mazure, K. Shin, and T.-J. K. Liu, “Impact of strained-silicon-on-insulator (sSOI) substrate on FinFET mobility,” IEEE Electron Device Letters, Vol. 27, No. 7, pp. 612-614, 2006.
• K. Shin, W. Xiong, C. Y. Cho, C. R. Cleavelin, T. Schulz, K. Schruefer, P. Patruno, L. Smith, and T.-J. K. Liu, “Study of bending-induced strain effects on MuGFET performance,” IEEE Electron Device Letters, Vol. 27, No. 8, pp. 671-673, 2006. 
• A. Carlson, Z. Guo, S. Balasubramanian, L.-T. Pang, T.-J. K. Liu, and B. Nikolic, “FinFET SRAM with enhanced read/write margins,”  IEEE International SOI Conference Digest, pp. 105-106, 2006.
• P. Kalra, P. Majhi, D. Heh, G. Bersuker, C. Young, N. Vora, R. Harris, P. Kirsch, R. Choi, M. Chang, J. Lee, H. Hwang, H.-H. Tseng, R. Jammy, and T.-J. K. Liu, “Impact of flash annealing on performance and reliability of high-k/metal-gate MOSFETs for sub-45nm CMOS,” International Electron Devices Meeting Technical Digest, pp. 353-356, 2007.
• R. Nathanael, W. Xiong, and T.-J. K. Liu, “Impact of gate-induced strain on MuGFET reliability,” IEEE Electron Device Letters, Vol. 29, pp. 916-919, 2008.
• V. Varadarajan and T.-J. K. Liu, “FinFET design for tolerance to statistical dopant fluctuations,” IEEE Transactions on Nanotechnology, Vol. 8, No. 3, pp. 375-378, 2009. 
• Best Paper Award and Best Student Paper Award: C. Shin, M. H. Cho, Y. Tsukamoto, B.-Y. Nguyen, B. Nikolic, and T.-J. K. Liu, “SRAM yield enhancement with thin-BOX FD-SOI,” presented at the IEEE International SOI Conference (Foster City, California, USA), October 2009.
• C. Shin, M. H. Cho, Y. Tsukamoto, B.-Y. Nguyen, C. Mazure, B. Nikolic, and T.-J. K. Liu, "Performance and area scaling benefits of FD-SOI technology for 6-T SRAM cells at the 22-nm node," IEEE Transactions on Electron Devices, Vol. 57, No. 6, pp. 1301-1309, 2010.
• N. Xu, X. Sun, W. Xiong, C. R. Cleavelin, and T.-J. K. Liu, "MuGFET carrier mobility and velocity: impacts of fin aspect ratio, orientation and stress," presented at the 2010 IEEE International Electron Devices Meeting (San Francisco, California, USA), December 2010.

• X. Sun, Q. Lu, V. Moroz, H. Takeuchi, G. Gebara, J. Wetzel, S. Ikeda, C. Shin, and T.-J. K. Liu, “Tri-gate bulk MOSFET design for CMOS scaling to the end of the roadmap,” IEEE Electron Device Letters, Vol. 29, no. 5, pp. 491-493, 2008.
• C. Shin, A. Carlson, X. Sun, K. Jeon, and T.-J. K. Liu, “Tri-gate bulk MOSFET design for improved robustness to random dopant fluctuations,” IEEE 2008 Silicon Nanoelectronics Workshop (Honolulu, HI, USA), June 2008.
• A. Carlson, X. Sun, C. Shin, and T.-J. K. Liu, “SRAM yield and performance enhancements with tri-gate bulk MOSFETs,” IEEE 2008 Silicon Nanoelectronics Workshop (Honolulu, HI, USA), June 2008.
• C. Shin, X. Sun, and T.-J. K. Liu, "Study of random-dopant-fluctuation (RDF) effects for the tri-gate bulk MOSFET," IEEE Transactions on Electron Devices, Vol. 56, No. 7, pp. 1538-1542, 2009.
• X. Sun and T.-J. K. Liu, “Scale length assessment of the tri-gate bulk MOSFET design,” IEEE Transactions on Electron Devices, Vol. 56, No. 11, pp. 2840-2842, 2009.
• R. Vega and T.-J. K. Liu, "Low standby power bulk MOSFET design using high-k trench isolation," IEEE Electron Device Letters, Vol. 30, No. 12, pp. 1380-1382, 2009.
• C. H. Tsai, T.-J. K. Liu, S. H. Tsai, C. F. Chang, Y. M. Tseng, R. Liao, R. M. Huang, P. W. Liu, C. T. Tsai, C. Shin, B. Nikolic, and C. W. Liang, "Segmented tri-gate bulk CMOS technology for device variability improvement," presented at the 2010 International Symposium on VLSI Technology, Systems, and Applications (Hsinchu, Taiwan R. O. C.), May 2010.
• Best Paper Award: C. Shin, B. Nikolic, T.-J. K. Liu, C. H. Tsai, M. H. Wu, C. F. Chang, Y. R. Liu, C. Y. Kao, G. S. Lin, K. L. Chiu, C.-S. Fu, C.-T. Tsai, and C. W. Liang, "Tri-gate bulk CMOS technology for improved SRAM scalability," presented at the 2010 European Solid-State Device Research Conference (Seville, Spain), September 2010.
• R. A. Vega and T.-J. K. Liu, "Comparative study of FinFET vs. quasi-planar HTI MOSFET for ultimate scalability," IEEE Transactions on Electron Devices, Vol. 57, No. 12, pp. 3250-3256, 2010.
• X. Sun, V. Moroz, N. Damrongplasit, C. Shin, and T.-J. K. Liu, "Variation study of the planar ground-plane bulk MOSFET, SOI FinFET and tri-gate bulk MOSFET designs," IEEE Transactions on Electron Devices, Vol. 58, No. 10, pp. 3294-3299, 2011.
• B. Ho, N. Xu, B. Wood, V. Tran, S. Chopra, Y. Kim, B.-Y. Nguyen, O. Bonnin, C. Mazure, S. Kuppurao, C.-P. Chang and T.-J. K. Liu, "Segmented-channel Si_1-xGe_x/Si pMOSFET for improved I_ON and reduced variability," presented at the 2012 Symposium on VLSI Technology (Honolulu, Hawaii, USA), June 2012.
• B. Ho, X. Sun, N. Xu, T. Sako, K. Maekawa, M. Tomoyasu, Y. Akasaka, O. Bonnin, B.-Y. Nguyen, and T.-J. K. Liu, “First demonstration of quasi-planar segmented-channel MOSFET design for improved scalability,” IEEE Transactions on Electron Devices, Vol. 59, No. 8, pp. 2273-2276, 2012.
• B. Ho, X. Sun, C. Shin, and T.-J. K. Liu, "Design optimization of multigate bulk MOSFETs,” IEEE Transactions on Electron Devices, Vol. 60, No. 1, pp. 28-33, 2013.
• B. Ho, N. Xu, B. Wood, V. Tran, S. Chopra, Y. Kim, B.-Y. Nguyen, O. Bonnin, C. Mazure, S. Kuppurao, C.-P. Chang, and T.-J. K. Liu, "Fabrication of Si_1-xGe_x/Si pMOSFETs using corrugated substrates for improved I_ON and reduced layout-width dependence," IEEE Transactions on Electron Devices, Vol. 60, No. 1, pp. 153-158, 2013.
• N. Xu, B. Ho, P. Zheng, B. Wood, V. Tran, S. Chopra, Y. Kim, O. Bonnin, C. Mazure, C.-P. Chang and T.-J. K. Liu, “Benefits of segmented Si/SiGe p-channel MOSFETs for analog/RF applications,” presented at the 2013 Symposium on VLSI Technology (Kyoto, Japan), June 2013.

•  W. Y. Choi, B.-G. Park, J. D. Lee, and T.-J. K. Liu, “Tunneling field-effect transistors (TFETs) with subthreshold swing (SS) less than 60 mV/dec,” IEEE Electron Device Letters, Vol. 28, No. 8, pp. 743-745, 2007.
• A. Padilla, C. W. Yeung, C. Shin, C. Hu, and T.-J. K. Liu, “Feedback FET: A novel transistor exhibiting steep switching behavior at low bias voltages,” IEEE International Electron Devices Meeting Technical Digest, 2008.
• S. H. Kim, H. Kam, C. Hu, and T.-J. K. Liu, "Germanium-source tunnel field effect transistors with record high I_ON/I_OFF," presented at the 2009 Symposium on VLSI Technology (Kyoto, Japan), June 2009.
• C. W. Yeung, A. Padilla, T.-J. K. Liu, and C. Hu, "Programming characteristics of the steep turn-on/off feedback FET (FBFET)," presented at the 2009 Symposium on VLSI Technology (Kyoto, Japan), June 2009.
• K. Jeon, W. Y. Loh, P. Patel, C. Y. Kang, J. Oh, A. Bowonder, C. Park, C. S. Park, C. Smith, P. Majhi, H.-H. Tseng, R. Jammy, T.-J. K. Liu, and C. Hu, "Si tunnel transistors with a novel silicided source and 46mV/dec swing," presented at the 2010 Symposium on VLSI Technology (Honolulu, Hawaii, USA), June 2010.
• S. H. Kim, Z. A. Jacobson, and T.-J. K. Liu, "Impact of body doping and thickness on the performance of germanium-source TFETs," IEEE Transactions on Electron Devices, Vol. 57, No. 7, pp. 1710-1713, 2010.
• S. H. Kim, S. Agarwal, Z. A. Jacobson, P. Matheu, C. Hu, and T.-J. K. Liu, "Tunnel field effect transistor with raised germanium source," IEEE Electron Device Letters, Vol. 31, No. 10, pp. 1107-1109, 2010.
• Invited: T.-J. K. Liu and S. H. Kim, "Tunnel FET promise and challenges," presented at the 2010 International Conference on Solid-State Devices and Materials (Tokyo, Japan), September 2010.

• Y.-C. King, T.-J. King, and C. Hu, "Charge-trap memory device fabricated by oxidation of Si_1-xGe_x," IEEE Transactions on Electron Devices, Vol. 48, No. 4, pp. 696-700, 2001.
• C. Kuo, T.-J. King, and C. Hu, “A capacitorless double-gate DRAM cell,” IEEE Electron Device Letters, Vol. 23, No. 6, pp. 345-347, 2002.
• M. She, H. Takeuchi, and T.-J. King, “Silicon-nitride as a tunnel dielectric for improved SONOS-type flash memory,” IEEE Electron Device Letters, Vol. 24, No. 5, pp. 309-311, 2003.
• M. She and T.-J. King, “Improved SONOS-type flash memory using HfO₂ as trapping layer,” presented at the 19th IEEE Non-Volatile Semiconductor Memory Workshop (Monterey, California, USA), pp. 53-55, 2003.
• C. Kuo, T.-J. King, and C. Hu, “Direct tunneling RAM (DT-RAM) for high-density memory applications,” IEEE Electron Device Letters, Vol. 24, No. 7, pp. 475-477, 2003.
• M. She and T.-J. King, “Impact of crystal size and tunnel dielectric on semiconductor nanocrystal memory performance,” IEEE Transactions on Electron Devices, Vol. 50, No. 9, pp. 1934-1940, 2003.
• C. Kuo, T.-J. King, and C. Hu, “A capacitorless double gate DRAM technology for sub-100-nm embedded and stand-alone memory applications,” IEEE Transactions on Electron Devices, Vol. 50, No. 12, pp. 2408-2416, 2003.
• P. Xuan, M. She, J. Bokor, and T.-J. King, “FinFET SONOS flash memory for embedded applications,” International Electron Devices Meeting Technical Digest, pp. 609-612, 2003.
• A. Padilla, T.-J. K. Liu, J. W. Hyun, I. Yoo, and Y. Park, “Dual-bit gate-sidewall-storage FinFET non-volatile memory cell and new method of charge detection,” IEEE Electron Device Letters, Vol. 28, No. 6, pp. 502-505, 2007.
• A. Padilla, S. Lee, D. Carlton, and T.-J. K. Liu, “Enhanced endurance of dual-bit SONOS NVM cells using the GIDL read method,” 2008 Symposium on VLSI Technology, Digest of Technical Papers, pp. 142-143, June 2008.
• M. H. Cho, C. Shin, and T.-J. K. Liu, “Convex channel design for improved capacitorless DRAM retention time,” presented at the 2009 International Conference on Simulation of Semiconductor Process and Devices (San Diego, CA, USA), September 2009.
• W. Kwon and T.-J. K. Liu, "A highly scalable 4F² DRAM cell utilizing a doubly gated vertical channel, " presented at the 2009 International Conference on Solid State Devices and Materials (Miyagi, Japan), October 2009.

• J. M. Heck, Chris G. Keller, A. E. Franke, Lilac Muller, R. T. Howe, and T.-J. King, “High aspect ratio poly-silicon-germanium microstructures,” Proceedings of the 1999 International Conference on Solid-State Sensors and Actuators -- Transducers ‘99 (Sendai, Japan), pp. 328-331, 1999.
• A. E. Franke, D. Bilic, D. T. Chang, P. T. Jones, T.-J. King, R. T. Howe, and G. C. Johnson, “Optimization of poly-silicon-germanium as a microstructural material,” in Proceedings of the 1999 International Conference on Solid-State Sensors and Actuators -- Transducers ‘99 (Sendai, Japan), pp. 530-533, 1999.
• A. E. Franke, Y. Jiao, M. T. Wu, T.-J. King, and R. T. Howe, “Post-CMOS modular integration of poly-SiGe microstructures using poly-Ge sacrificial layers,” Solid-State Sensor and Actuator Workshop Technical Digest, pp. 18-21, June 2000.
• A. E. Franke, T.-J. King, and R. T. Howe, “Integrated MEMS technologies,” MRS Bulletin, Vol. 26, No. 4, pp. 291-295, 2001.
• S. A. Bhave, B. L. Bircumshaw, W. Z. Low, Y.-S. Kim, T.-J. King, R. T. Howe, and A. P. Pisano, “Poly-SiGe: A high-Q structural material for integrated RF MEMS,” Solid-State Sensor and Actuator Workshop, Technical Digest, pp. 34-37, 2002.
• Invited Paper: T.-J. King, R. T. Howe and S. Sedky "Recent progress in modularly integrated MEMS technologies," International Electron Devices Meeting Technical Digest, pp. 199-202, 2002.
• M.-A. E. Eyoum and T.-J. King, “Low resistance silicon-germanium technology for modular integration of MEMS with electronics,” Journal of the Electrochemical Society, Vol. 151, No. 3, pp. J21-J25, 2004.
• C. W. Low, M. L. Wasilik, H. Takeuchi, T.-J. King, and R. T. Howe, “In-situ doped poly-SiGe LPCVD process using BCl₃ for post-CMOS integration of MEMS devices,” presented at the Symposium on SiGe: Materials, Processing, and Devices (part of the 2004 Joint International Meeting of The Electrochemical Society, The Electrochemical Society of Japan and The Japan Society of Applied Physics), (Honolulu, Hawaii, USA), October 2004.
• D. T. Lee, T. Osabe, and T.-J. K. Liu, "Scaling limitations for beams used in electromechanical devices," IEEE Transactions on Electron Devices, Vol. 56, No. 4, pp. 688-691, 2009.
• E. S. Park, Y. Chen, T.-J. K. Liu, and V. Subramanian, "Inkjet-printed microshell encapsulation: a new zero-level packaging technology," presented at the 25th IEEE International Conference on Micro Electro Mechanical Systems (Paris, France), 2011.

• W. Y. Choi, H. Kam, D. Lee, J. Lai, and T.-J. K. Liu, “Compact nano-electro-mechanical non-volatile memory (NEMory) for 3D integration,” Int’l Electron Devices Meeting Technical Digest, pp. 603-606, 2007.
• W. Y. Choi, T. Osabe and T.-J. K. Liu, “Nano-electro-mechanical nonvolatile memory (NEMory) cell design and scaling,” IEEE Transactions on Electron Devices, Vol. 55, No. 12, pp. 3482-3488, 2008.
• W. Y. Choi and T.-J. K. Liu, "Reliability of nanoelectromechanical nonvolatile memory (NEMory) cells," IEEE Electron Device Letters, Vol. 30, No. 3, pp. 269-271, 2009.
• W. Kwon, J. Jeon, L. Hutin, and T.-J. K. Liu, "Electromechanical diode cell for cross-point nonvolatile memory arrays," IEEE Electron Device Letters, Vol. 33, No. 2, pp. 131-133, 2012.
• L. Hutin, W. Kwon, C. Qian and T.-J. K. Liu, “Electromechanical diode cell scaling for high-density nonvolatile memory,” IEEE Transactions on Electron Devices, Vol. 61, No. 5, pp. 1382-1387, 2014.

• R. Nathanael, V. Pott, H. Kam, J. Jeon, and T.-J. K. Liu, "4-terminal relay technology for complementary logic," presented at the 2009 IEEE International Electron Devices Meeting (Baltimore, Maryland, USA), December 2009.
• H. Kam, V. Pott, R. Nathanael, J. Jeon, E. Alon, and T.-J. K. Liu, "Design and reliability of a micro-relay technology for zero-standby-power digital logic applications," presented at the 2009 IEEE International Electron Devices Meeting (Baltimore, Maryland, USA), December 2009.
• J. Jeon, V. Pott, H. Kam, R. Nathanael, E. Alon, and T.-J. K. Liu, "Perfectly complementary relay design for digital logic applications," IEEE Electron Device Letters, Vol. 31, No. 4, pp. 371-373, 2010.
• J. Jeon, R. Nathanael, V. Pott, and T.-J. K. Liu, "Four-terminal relay design for improved body effect," IEEE ELectron Device Letters, Vol. 31, No. 5, pp. 515-517, 2010.
• R. Nathanael, V. Pott, H. Kam, J. Jeon, E. Alon, and T.-J. K. Liu, "Four-terminal-relay body-biasing schemes for complementary logic circuits," IEEE Electron Device Letters, Vol. 31, No. 8, pp. 890-892, 2010.
• Invited: V. Pott, H. Kam, R. Nathaniel, J. Jeon, E. Alon, and T.-J. K. Liu, "Mechanical computing redux: Relays for integrated circuit applications," Proceedings of the IEEE, Vol. 98, No. 12, pp. 2076-2094, 2010.
• H. Kam, E. Alon, and T.-J. K. Liu, "A predictive contact reliability model for MEM logic switches," presented at the 2010 IEEE International Electron Devices Meeting (San Francisco, California, USA), December 2010. 
• Invited: T.-J. K. Liu, J. Jeon, R. Nathanael, H. Kam, V. Pott, and E. Alon, "Prospects for MEM-relay logic switch technology," presented at the IEEE International Electron Devices Meeting (San Francisco, California, USA), December 2010.
• H. Kam, T.-J. K. Liu, V. Stojanovic, D. Markovic, and E. Alon, "Design, optimization and scaling of MEM relays for ultra-low-power digital logic," IEEE Transactions on Electron Devices, Vol. 58, No. 1, pp. 236-250, 2011.
• E. S. Park, Y. Chen, T.-J. K. Liu, and V. Subramanian, "Printed micro-electromechanical switches," presented at the IEEE International Electron Devices Meeting (Washington DC, USA), 2011.
• J. Jeon, L. Hutin, R. Jevtic, N. Liu, Y. Chen, R. Nathanael, W. Kwon, M. Spencer, E. Alon, B. Nikolic, and T.-J. K. Liu, "Multi-input relay design for more compact implementation of digital logic circuits," IEEE Electron Device Letters, Vol. 33, No. 2, pp. 281-283, 2012.
• T.-J. K. Liu, L. Hutin, I-R. Chen, R. Nathanael, Y. Chen, and E. Alon, "Recent progress and challenges for relay logic switch technology," presented at the 2012 Symposium on VLSI Technology (Honolulu, Hawaii, USA), June 2012.
• E. S. Park, Y. Chen, T. J. K. Liu, and V. Subramanian, “A new switching device for printed electronics: Inkjet-printed microelectromechanical relay,” Nano Letters Vol. 13, No. 11, pp. 5355-5360, 2013.
• H. Kam, Y. Chen and T.-J. K. Liu, "Reliable micro-electro-mechanical (MEM) switch design for ultra-low power logic," presented at the 2013 IEEE International Reliability Physics Symposium (Monterey, California, USA), April 2013.
• I-R. Chen Y. P. Chen, L. Hutin, V. Pott, R. Nathanael and T.-J. King Liu, “Stable Ruthenium-contact relay technology for low-power logic,” presented at the 17th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2013 (Barcelona, Spain), June 2013.
• Y. P. Chen, E. S. Park, I-R. Chen, L. Hutin, V. Subramanian and T.-J. King Liu, “Micro-relay reliability improvement by inkjet-printed microshell encapsulation,” presented at the 17th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2013 (Barcelona, Spain), June 2013.

• F. Chen, H. Kam, D. Markovic, T.-J. K. Liu, V. Stojanovic and E. Alon, “Integrated circuit design with NEM relays,” 2008 IEEE/ACM International Conference on Computer-Aided Design, pp. 750-757, 2008.
• Jack Raper Award for Outstanding Technology-Directions: F. Chen, M. Spencer, R. Nathanael, C. Wang, H. Fariborzi, A. Gupta, H. Kam, V. Pott, J. Jeon, T.-J. K. Liu, D. Markovic, V. Stojanovic, and E. Alon, "Demonstration of integrated micro-electro-mechanical (MEM) switch circuits for VLSI applications," 2010 International Solid State Circuits Conference (San Francisco, California, USA), pp. 150-151, 2010.
• J. Jeon, V. Pott, H. Kam, R. Nathanael, E. Alon, and T.-J. K. Liu, "Seesaw relay logic and memory circuits," IEEE/ASME Journal of MicroElectroMechanical Systems, Vol. 19, No. 4, pp. 1012-1014, 2010.
• H. Fariborzi, M. Spencer, V. Karkare, J. Jeon, R. Nathanael, C. Wang, F. Chen, H. Kam, V. Pott, T.-J. K. Liu, E. Alon, V. Stojanovic, and D. Markovic, "Analysis and demonstration of MEM-relay power gating," presented at the 2010 Custom Integrated Circuits Conference (San Jose, California, USA), September 2010.
• M. Spencer, F. Chen, C. Wang, R. Nathanael, H. Fariborzi, A. Gupta, H. Kam, V. Pott, J. Jeon, T.-J. K. Liu, D. Markovic, E. Alon, and V. Stojanovic, "Demonstration of integrated micro-electro-mechanical relay circuits for VLSI applications," IEEE Journal of Solid-State Circuits, Vol. 46, No. 1, pp. 308-320, 2011.

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